maximum ratings and electrical characteristics pa ra m et er sy m bo l un it maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 0.375"(9.5mm) lead length @t a =55c peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (jedec method) maximum forward voltage at 1.0a dc maximum reverse current at rated dc blocking voltage t a =125c operating temperature range storage temperature range t a =25c maximum reverse recovery time (note 3) t ypical junction capacitance (note 1) t ypical thermal resistance (note 2) uf4001 -g 50 35 50 v rrm v rms v dc i (a v) i fsm v f i r t rr c j r ja t j t stg 1.0 30 10 50 15 60 -55 ~ +150 -55 ~ +150 v v v a a v ns pf c c a c/w notes: 1. measured at 1.0mhz and applied reverse voltage of 4.0v olts. 2. thermal resistance from junction to ambient at 0.375"(9.5mm) lead length, p .c. board mounted. 3. reverse recovery time test condition: i f =0.5a, i r =1.0a, i rr =0.25a. v oltage: 50 to 1000 v current: 1.0 a rohs device d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) d o - 4 1 features -low cost construction. -fast switching for high ef ficiency . -low reverse leakage. -high forward surge current capability . -high soldering temperature guarantee: 260c/10 seconds, 0.375(9.5mm) lead length at 5lbs(2.3kg) tension. mechanical data -case: transfer molded plastic, do-41 -epoxy: ul 94v -0 rate flame retardant -polarity: indicated by cathode band -lead: plated axial lead, solderable per mil-std- 202e, method 208c -mounting position: any -w eight: 0.33 grams uf4002 -g 100 70 100 uf4003 -g 200 140 200 uf4004 -g 400 280 400 uf4005 -g 600 420 600 uf4006 -g 800 560 800 uf4007 -g 1000 700 1000 uf4001-g thru. 07-g uf40 page 1 qw -bu006 ultra fast recovery rectifiers rev :b comchip t echnology co., l td. 0 . 2 0 5 ( 5 . 2 0 ) 1 . 0 ( 2 5 . 4 0 ) m i n . 0. 10 7( 2. 70 ) 0.0 34 (0 .90 ) 0.0 28 (0 .70 ) 0. 08 0( 2. 00 ) 0 . 1 6 0 ( 4 . 2 0 ) 1 . 0 ( 2 5 . 4 0 ) m i n . 1.0 1.7 50 75 ratings at 25c ambient temperature unless otherwise specified. single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%.
50 non-inductive 10 non-inductive d.u.t . 1 non inductive oscilloscope (note 1) pulse generator (note 2) (+) 25vdc (approx) (-) (-) notes:1.rise time=7ns max. input impedance=1m , 22pf 2.rise time=10ns max. source impedance=50 set time base for 50/100ns/cm 1cm -1.0a 0 +0.5a -0.25a t rr page 2 qw -bu006 ultra fast recovery rectifiers rev :b comchip t echnology co., l td. rating and characteristic curves (uf4001 ) -g thru. uf4007-g fig.2 max. non-repetitive peak forward surge current 0 f s m , p e a k f o r w a r d s u r g e c u r r e n t ( a ) number of cycles at 60hz 1 fig.1 t ypical forward current derating curve i ( a v ) , a v e r a g e f o r w a r d c u r r e n t ( a ) o t a , ambient t emperature ( c) 0 2 5 7 5 1 7 5 fig.3 t ypical instantaneous forward characteristics 0 . 0 1 i f , i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) v f , instantaneous forward v oltage (v) 1 2 0 0 . 6 1 . 0 1 . 4 0 0 . 6 1 . 0 1 . 6 2 . 0 1 0 0 1 5 3 5 1 . 2 0 . 1 fig.4 t ypical reverse characteristics 0 . 1 i r , i n s t a n t a n e o u s r e v e r s e c u r r e n t ( m a ) percent of peak reverse v oltage (%) 1 0 1 0 0 1 1 0 0 1 2 5 0 . 4 0 . 8 0 . 8 1 . 8 fig.5 t ypical junction capacitance 1 0 c j , c a p a c i t a n c e ( p f ) v r , reverse v oltage (v) 1 0 0 0 0 . 1 1 0 1 0 0 1 0 0 5 0 1 5 0 0 . 2 1 0 5 1 0 2 5 3 0 1 . 2 0 4 0 8 0 1 0 0 1 4 0 2 0 1 2 0 6 0 1 single phase half wave, 60hz resistive or inductive load 0.375"(9.5mm) lead length 2 0 8.3ms, single half sine-wave, jedec method. t j =t jmax 1 cycle 1 0 pulse width=300 s. 1% duty cycle o t j =25 c u f 4 0 g ~ u 4 0 - g 0 1 - f 0 4 f 4 0 0 g f 4 0 0 g u 5 - ~ u 7 - o t j =100 c o t j =25 c o t j =150 c f=1mhz o t j =25 c v sig =50mv p-p fig.6 t est circuit of reverse recovery t ime characteristics
ultra fast recovery rectifiers b specification for axial- lead rectifiers ammo box packaging l 1 l 2 e a z t e 90 5 b z t e l 1 - l 2 d o - 4 1 s y m b o l a ( m m ) ( i n c h ) l h w 5 2 . 4 1 . 5 1 . 2 6 . 0 0 . 4 0 . 8 ( m a x ) 1 . 0 ( m a x ) 5 . 0 0 . 5 2 . 0 6 3 0 . 0 5 9 0 . 0 4 8 0 . 2 3 6 0 . 0 1 6 0 . 0 3 2 ( m a x ) 0 . 0 4 0 ( m a x ) 0 . 1 9 7 0 . 0 2 0 s y m b o l bo x le ng th ( m m ) ( i n c h ) 2 4 5 . 0 5 . 0 9 . 6 4 6 0 . 1 9 7 bo x wid th 7 5 . 0 5 . 0 2 . 9 5 3 0 . 1 9 7 bo x he ig ht 9 0 . 0 5 . 0 3 . 5 4 3 0 . 1 9 7 d o - 4 1 c o m c h i p s m d d i o d e s p e c i a l i s t page 3 qw -bu006 rev :b comchip t echnology co., l td. c a s e t y p e d o - 4 1 b o x ( p c s ) a m m o p a c k c a r t o n ( p c s ) 2 , 5 0 0 4 5 , 0 0 0 standard packaging
|
